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filingDate 2020-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2021-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112582402-A
titleOfInvention Semiconductor device and method of manufacturing the same
abstract A method of fabricating a device includes providing a first fin in a first device type region and providing a second fin in a second device type region. Each of the first fin and the second fin includes a plurality of semiconductor channel layers. A two-step recess of the STI region is performed on opposite sides of each of the first fin and the second fin to expose a first number of semiconductor channel layers of the first fin and a second number of semiconductor trenches of the second fin Dao layer. The first gate structure is formed in the first device type region, and the second gate structure is formed in the second device type region. A first gate structure is formed over a first fin having a first number of exposed semiconductor channel layers, and a second gate structure is formed over a second fin having a second number of exposed semiconductor channel layers. Embodiments of the present invention also relate to semiconductor devices and methods of fabricating the same.
priorityDate 2019-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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