abstract |
The present invention relates to a semiconductor device and a method of manufacturing the semiconductor device, and an object of the present invention is to obtain a semiconductor device and a method of manufacturing the semiconductor device that can suppress damage to bonding wires. The semiconductor device according to the present invention includes: a base plate; a first semiconductor chip provided on the base plate; a bonding wire bonded to the first semiconductor chip at a first bonding portion, and the bonding wire is A curved portion is provided above the first joint portion; a first package member is provided from the upper surface of the base plate to a height higher than the first joint portion and lower than the curved portion, and covers the first encapsulation member. a joint portion; and a second package member provided on the first package member to cover the bent portion, and the second package member has a lower elastic modulus than the first package member. |