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filingDate 2020-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40dc9a04c9c4676a47732a8092fb067e
publicationDate 2021-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112582357-A
titleOfInvention Semiconductor device and method of manufacturing the same
abstract The present invention relates to a semiconductor device and a method of manufacturing the semiconductor device, and an object of the present invention is to obtain a semiconductor device and a method of manufacturing the semiconductor device that can suppress damage to bonding wires. The semiconductor device according to the present invention includes: a base plate; a first semiconductor chip provided on the base plate; a bonding wire bonded to the first semiconductor chip at a first bonding portion, and the bonding wire is A curved portion is provided above the first joint portion; a first package member is provided from the upper surface of the base plate to a height higher than the first joint portion and lower than the curved portion, and covers the first encapsulation member. a joint portion; and a second package member provided on the first package member to cover the bent portion, and the second package member has a lower elastic modulus than the first package member.
priorityDate 2019-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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