http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112578633-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2020-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112578633-B |
| titleOfInvention | Photoresist |
| abstract | The invention provides a photoresist which is used for manufacturing circuits of a PCB (printed circuit board), an FPC (flexible printed circuit), an HDI (high density interconnect) board, an aluminum foil and a composite metal plate. Particularly, the photoresist contains 1-20 parts by weight of a polymer component (A), wherein the polymer component (A) is at least one of polycarbonate (A0), polycarbonate acrylate (A1) and polycarbonate methacrylate (A2); the adhesive also comprises 40-70 parts by weight of linear carboxyl-containing (methyl) acrylate adhesive (B), 0.01-3.0 parts by weight of flatting agent (C), 5-20 parts by weight of vinyl acrylate photo-curing monomer (D), 0.5-2.0 parts by weight of free radical initiator (E) and 0.01-2.0 parts by weight of dye (F). The invention can reduce the thickness of the photoresist layer on the premise of meeting the basic performance of the photoresist. |
| priorityDate | 2020-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 95.