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filingDate 2020-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2023-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2023-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112574690-B
titleOfInvention A special low-viscosity and high-temperature-resistant pressure-sensitive adhesive for electronic products and its preparation and protective film
abstract The invention belongs to the technical field of special functional film materials, and discloses a special low-viscosity and high-temperature-resistant pressure-sensitive adhesive for electronic products, a preparation method and application thereof, and a protective film based on the same. The pressure-sensitive adhesive formula of the present invention includes an alkynyl-containing acrylate copolymer, an azide-containing acrylate copolymer and a catalyst. Wherein, the alkynyl-containing acrylate copolymer adopts 2-2-(2-naphthylthio) ethyl acrylate as a monomer, and it and the azide-containing acrylate copolymer adopt "alkynyl-azide" click chemical cycloaddition Cross-linking system to generate high temperature-resistant 1,4-disubstituted-1,2,3-triazole cross-linking points, thereby improving the temperature resistance of acrylate pressure-sensitive adhesives, and obtaining pressure-sensitive adhesives with low viscosity and excellent high temperature resistance Sensitive adhesive, which effectively solves the technical problem of insufficient high temperature resistance of traditional acrylic pressure sensitive adhesives. The low-viscosity and high-temperature-resistant pressure-sensitive adhesive of the present invention has excellent foam removal and lamination properties, and the temperature resistance is as high as 200°C.
priorityDate 2020-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 56.