| abstract |
The invention aims to provide a photosensitive resin composition capable of forming a resist pattern with excellent resolution and capable of coping with copper plating and nickel plating, a method for forming a resist pattern by using the photosensitive resin composition, and a plating formed object by using the resist patternThe composition contains a polymer (A) having a structural unit (a1) represented by the following formula (a1), a structural unit (a2) represented by the following formula (a2), and a structural unit (a3) represented by the following formula (a3), and a photoacid generator (B). In the formula (a3), R 33 Represents a hydroxyaryl group. |