http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112521751-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-222 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-385 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-34 |
| filingDate | 2020-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2023-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2023-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112521751-B |
| titleOfInvention | A kind of silicone resin composition and its application |
| abstract | The invention provides a silicone resin composition and its application. The silicone resin composition comprises the following components by weight percentage: cage silicone resin 8-40%, thermal conductive filler 30-60%, organic solvent 10-30% and Curing agent 0.1 to 3%. The preparation method of the cage-type silicone resin is: (1) utilizing ethyl orthosilicate, hexamethyldisiloxane, ethanol and hydrochloric acid to react at room temperature; (2) exothermic reaction, and the reaction temperature is naturally heated up When the temperature reaches 30-33° C., add hydroxyl POSS, ethanol and hydrochloric acid, and continue the reaction by raising the temperature; (3) add hexamethyldisiloxane to the reaction solution in step (2), and carry out a capping reaction to obtain the cage-type Silicone. The silicone resin composition of the invention has low dielectric constant, low dielectric loss tangent, good heat resistance and fast heat dissipation, and is suitable for high-frequency and high-speed PCB boards. |
| priorityDate | 2020-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.