| abstract |
(A) organopolysiloxane having one or more silicon atom-bonded alkenyl groups in one molecule, (B) organohydrogenpolysiloxane having two or more silicon atom-bonded hydrogen atoms in one molecule, (C) platinum group metal-based curing catalyst, (D) isocyanuric acid derivative having two trialkoxysilyl groups and one crosslinkable vinyl group, and/or three trialkoxymethyl groups The silicone gel composition of a silyl-based isocyanuric acid derivative, (E) an enonesilyl ketal type compound, and a cured product giving a specific penetration can form a silicone gel cured product that is Silicone gel with excellent heat resistance at high temperature, excellent adhesion to metal, and high penetration, not only can maintain low elastic modulus and low stress even through long-term use at high temperature, but also suppress the formation of air bubbles. Generation, peeling from the substrate, and reduction in electrical insulation. |