| abstract |
The invention discloses an easy-to-solder PCB comprising a base plate and an electrode structure formed on the base plate. The electrode structure includes a tin-indium Sn/In composite layer, and a copper-Cu layer and a gold-Au layer may also be provided between the tin-indium Sn/In composite layer and the substrate. Due to the lower melting point of indium In, the energy required for welding is much lower than that of tin Sn, and because the molten indium In has strong fluidity, the tin Sn layer and the molten indium In have good wettability, so that the Indium In does not overflow outside the electrodes to cause a short circuit. Therefore, the present invention provides an easy-to-solder PCB, which requires lower energy during welding, has a denser film layer, better electrical and thermal conductivity, and higher welding yield. |