http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112480848-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0806 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
| filingDate | 2020-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112480848-B |
| titleOfInvention | Electric and heat conducting silver adhesive for chip bonding and preparation method thereof |
| abstract | The application relates to the field of semiconductor chip packaging materials, and particularly discloses an electric and heat conducting silver adhesive for chip bonding and a preparation method thereof. An electric and heat conducting silver adhesive for chip bonding is prepared from the following raw materials in parts by weight: epoxy resin, acrylic resin, a curing agent, an ester flexibilizer, a coupling agent, an antioxidant, a dispersing agent, silver powder and silicon powder; the preparation method comprises the following steps: s1, heating and mixing epoxy resin, acrylic resin, a curing agent, an ester flexibilizer, a coupling agent, an antioxidant and a dispersing agent, heating to 70-85 ℃, and mixing for 1-2 hours to obtain a premix; s2, mixing the pre-mixed body, the silver powder and the silicon powder at the mixing temperature of 80-90 ℃ to obtain a mixed body; and S3, stirring the mixed mixture at room temperature for 0.5-2 h, and performing vacuum drying and degassing to obtain the electric and heat conductive silver adhesive. The electric and heat conducting silver adhesive has the advantage of improving the operation performance of the electric adhesive. |
| priorityDate | 2020-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.