| abstract |
The invention discloses a surface treatment agent for an n-type bismuth telluride-based thermoelectric material, which comprises two parts: a roughening liquid and a ash removal liquid; ～30% nitric acid, 5～50% glacial acetic acid, 5～20% sulphuric acid, and the balance is water; the ash removal liquid includes solvent and solute, and the solvent by volume percentage includes: 5～20% nitric acid, 5～20% Hydrochloric acid, the balance of water, the solute is potassium bromate, the concentration is 1 ~ 10g/L. When the surface treatment agent is used, the roughening liquid and the ash removal liquid are used together. The clean n-type bismuth telluride-based wafer is first immersed in the coarsening liquid, and then immersed in the ash removal liquid to complete the pretreatment, and then directly pass the Metallized connections are made by electroplating or electroless plating. The surface treatment agent and method for the n-type bismuth telluride-based thermoelectric material proposed by the present invention enable the n-type bismuth telluride-based wafer to have higher surface activity before electroplating, which is beneficial to obtain higher bonding strength of the plating layer, and has a good effect on the wafer. Without any physical damage, improve product qualification rate. |