| abstract |
To provide a resin composition capable of improving resistance to flux used for soldering and reflow resistance, and to provide a thick film that can be processed with high sensitivity even if it is a thick film of 15 μm or more after curing when used as a photosensitive resin composition Processability. A resin composition comprising: (A) a resin having a structural unit represented by the general formula (1) and/or the general formula (2), (B) a phenolic resin, (C) an antioxidant, the (B) phenolic resin The structure represented by the general formula (3) is included. |