| abstract |
The present invention provides a method of forming a semiconductor package and a semiconductor package, the method comprising: providing a semiconductor device, the semiconductor device at least comprising: a semiconductor wafer and at least two metal pads located above the semiconductor wafer; forming over the semiconductor device a seed crystal layer; forming a first photoresist layer over the seed crystal layer; forming a first opening in the first photoresist layer, wherein the first opening is located directly above at least a portion of the first metal pad; forming a first metal feature of a first height in the first opening; removing the first photoresist layer; forming a second photoresist layer over the seed layer; forming a second opening in the second photoresist layer, wherein , the second opening is located directly above at least a part of the second metal pad; a second metal part with a second height is formed in the second opening; and the second photoresist layer is removed. Using the above method, the height of the metal bumps of different sizes can be controlled. |