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filingDate 2020-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_950d0a8e2d459fef7cb129fef3685aa8
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publicationDate 2021-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112397379-A
titleOfInvention Laser local annealing amorphous polycrystalline composite photoelectron integration method
abstract The invention discloses a laser local annealing amorphous polycrystalline composite photoelectron integration method, which comprises the following steps: growing an amorphous silicon film on a silicon wafer (a waveguide lower cladding layer is covered on the silicon wafer) and depositing a protective layer, preparing a metal pattern on the protective layer, etching off the protective layer which is not covered by part of the metal pattern, and injecting doping ions into the amorphous silicon film; scanning laser beams over the metal pattern at a certain speed, reflecting most of the energy of the laser beams by the metal pattern covering area, forming a molten state by amorphous silicon at the uncovered part due to the absorption of a large amount of laser beam energy, activating implanted doping ions, finally forming polycrystalline silicon by annealing crystallization, and then carrying out a conventional process of a CMOS compatible silicon optical device. The method can realize the preparation of the amorphous polycrystalline composite photonic device under the low-temperature process, can directly integrate a low-loss high-speed photonic link on an electronic chip, and realizes a high-performance monolithic integrated photoelectric fusion chip.
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type http://data.epo.org/linked-data/def/patent/Publication

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