abstract |
The present invention addresses the problem of providing a photosensitive resin composition having excellent resistance to a strongly basic etching solution containing 15 to 45 mass% of an alkali metal hydroxide and 5 to 40 mass% of an ethanolamine compound, and an etching method using the photosensitive resin composition, and by providing an etching method using the photosensitive resin composition and a method for producing a resin structure, wherein the photosensitive resin composition contains at least (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) a polymerizable monomer, contains 5 to 80 mass% of a compound having an m + n represented by general formula (i) of 2 to 7 inclusive as (C) the polymerizable monomer, or contains a compound having an m + n represented by general formula (i) of 2 to 20 inclusive as (C) the polymerizable monomer when (A) the alkali-soluble resin is a copolymer of styrene and methacrylic acid, the content of the compound having m + n of 2 to 7 is 80% by mass or less. |