http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112384330-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y80-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-736 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y50-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y70-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B33Y80-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-336 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-344 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C64-112 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-28 |
| filingDate | 2019-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112384330-B |
| titleOfInvention | Polishing pad formed using additive manufacturing process and related methods |
| abstract | Embodiments of the present disclosure generally relate to polishing pads and methods of making polishing pads that may be used in chemical mechanical polishing (CMP) processes in semiconductor device fabrication. The polishing pads described herein are characterized by a continuous polymer phase of polishing pad material that includes one or more domains of a first material and a plurality of domains of a second material. The one or more first material domains are formed from a polymerization reaction product of a first prepolymer composition, the plurality of second material domains are formed from a polymerization reaction product of a second prepolymer composition, the second prepolymer composition The polymer composition is different from the first prepolymer composition, and the interfacial region between the one or more first material domains and the plurality of second materials is composed of the first prepolymer composition and the second prepolymer composition formed by the copolymerization reaction product. |
| priorityDate | 2019-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 114.