http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112367798-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cfd064bc0ee82359d196fab99a0adc1b |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20318 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-2039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-2029 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-427 |
| filingDate | 2020-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_becc80dc6707d28b865dfe54a9bcc923 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cc199ab758df534800dcb4a2f3ee5ca |
| publicationDate | 2021-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112367798-A |
| titleOfInvention | Heat conduction structure, method for manufacturing the same, and mobile device |
| abstract | The title of the present invention is a heat conduction structure, a manufacturing method thereof, and a mobile device. The invention discloses a heat conduction structure, which comprises a heat conduction unit, a first heat conduction layer, a metal microstructure, a second heat conduction layer and a working fluid. The heat-conducting unit forms a closed cavity, and the closed cavity has opposite bottom surfaces and top surfaces, and opposite ends of the heat-conducting unit are respectively used as heat source ends and cooling ends. The first heat conduction layer is disposed on the bottom surface and/or the top surface of the closed cavity. The metal microstructure is disposed on the first heat conduction layer. The second heat conduction layer is disposed on the side of the metal microstructure away from the first heat conduction layer. Wherein, the thickness sum of the first heat conduction layer and the second heat conduction layer adjacent to the heat source end is greater than the thickness sum of the thickness away from the heat source end. Wherein, the materials of the first heat conduction layer and the second heat conduction layer in the first section of the stacked structure are at least partially different from those of the first heat conduction layer and the second heat conduction layer in the second section. The invention also discloses a manufacturing method and a mobile device. |
| priorityDate | 2019-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 38.