http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112359236-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F2998-10 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F3-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F3-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1637 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C27-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-15 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112359236-B |
| titleOfInvention | Process for preparing high-density tungsten-copper alloy metal material by using tungsten powder |
| abstract | A process for preparing a high-density tungsten-copper alloy metal material by using tungsten powder comprises the following steps: (1) dispersing tungsten powder into copper plating solution, and pre-plating copper by adopting a chemical plating method; then transferring the tungsten powder subjected to copper preplating to CuSO 4 Carrying out copper electroplating in an acid electroplating solution, and carrying out post-treatment after electroplating to obtain copper-coated tungsten composite powder; (2) pouring the copper-coated tungsten composite powder prepared in the step (1) into a graphite mold, then placing the graphite mold into a discharge plasma sintering furnace, vacuumizing and pressurizing to obtain a sintered body; (3) and (3) carrying out hot isostatic pressing and re-sintering on the sintered body obtained in the step (2), and finally obtaining the high-density tungsten-copper alloy with the density of more than 99.5%. The invention solves the defects of difficult sintering and low densification degree of the tungsten-copper alloy. |
| priorityDate | 2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.