| abstract |
The present invention relates to a bonding method in which two substrates are adhesively bonded to each other by applying a curable but not yet cured two-component adhesive to the surface of at least one of the two substrates, said The two-component adhesive includes in the first component compound A having at least one specific cyclic thiocarbonate unit having a five-membered ring structure, and in the second component a hardener compound B, which hardens The agent compound B is selected from compounds having at least one functional group selected from primary and secondary amino groups. |