| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02244 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02337
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02343
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02307
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02263 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324 |
| filingDate |
2019-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bfe31eba69d6b134cc2b66b7b7d9909
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df84a452448a8906e5bcf5dda4233f77
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2286f280d8f310d93555bb138a4b511 |
| publicationDate |
2021-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-112335016-A |
| titleOfInvention |
Efficient cleaning and etching of high aspect ratio structures |
| abstract |
A method of processing a substrate includes positioning the substrate in a processing chamber. At least one of a vaporized solvent and a gas mixture comprising the solvent is supplied to the processing chamber to form a conformal liquid layer of the solvent on the exposed surface of the substrate. The at least one of the vaporized solvent and the gas mixture is removed from the processing chamber. A reactive gas containing halogen species is supplied to the processing chamber. The conformal liquid layer adsorbs the reactive gas to form a reactive liquid layer that etches the exposed surface of the substrate. |
| priorityDate |
2018-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |