| abstract |
The present invention provides a curable composition which is excellent in processability and can form a cured product having super heat resistance. The curable composition of the present invention contains a compound represented by the following formula (1) and a solvent. In the following formula (1), R 1 and R 2 represent a curable functional group, and D 1 and D 2 represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by the following formula (I) and a structure represented by the following formula (II). In the following formulae (I) and (II), Ar 1 to Ar 3 represent a group obtained by removing two hydrogen atoms from the structural formula of an aromatic ring, or a bond from two or more aromatic rings via a single bond or a linking group A group obtained by removing two hydrogen atoms in the synthesized structural formula. X represents ‑CO‑, ‑S‑, or ‑SO 2‑ , and Y represents ‑S‑, ‑SO 2‑ , ‑O‑, ‑CO‑, ‑COO‑, or ‑CONH‑. n represents an integer of 0 or more. |