| abstract |
To provide an epoxy resin composition capable of obtaining a cured product having excellent heat resistance, adhesiveness, and a lower dielectric loss tangent, and a cured product thereof. Specifically, it is an epoxy resin composition, which contains an α-naphthol biphenyl aralkyl type epoxy resin, and a curing agent, and the curing agent contains an active ester structure. The α-naphthol biphenyl aralkyl type epoxy resin preferably has a structure represented by formula (1). The curing agent preferably has a structure represented by formula (2). The curing agent is preferably an active ester compound or resin using a compound having two or more phenolic hydroxyl groups and an aromatic monocarboxylic acid or its acid halide as essential reaction raw materials. |