| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a526bd9fc7a84fa4a3326b8655d1af37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2463-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2377-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2020-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_402177bab04687ce210df70b82a55506
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc1f9f50e8874f541cadea52a5fb0e73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db92dce3432b3b9f517bd5fc1db34931
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6304abedde2fb729bcfcc8edf33a312d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24cd2f7ed59c717c144e2506487654f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_390d79c3ba2ad9bab8d965c9d73cc683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5943cfa440d9e1cc80c5d6b2427d5cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4e2fee420bd914c76b502af121bacd7 |
| publicationDate |
2021-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-112280293-A |
| titleOfInvention |
A kind of hot-melt epoxy resin composition, preparation method and hot-melt prepreg |
| abstract |
The invention relates to a hot-melt epoxy resin composition, a preparation method and a hot-melt prepreg thereof. The hot-melt epoxy resin composition comprises the following components in parts by mass: 100 parts of main epoxy resin; curing agent A 4 to 6 parts; 5 to 15 parts of curing agent B; 2 to 4 parts of urea accelerator; 5 to 20 parts of thermoplastic resin modifier; Or amide group thermoplastic resin is heated and mixed evenly, and then add amide and latent curing agent system at a certain temperature to obtain a hot-melt epoxy resin matched with aramid fiber, the preparation method is simple and feasible, the resin The matrix has good manufacturability and layability, and the bonding performance between the resin matrix and the aramid fiber is significantly enhanced. Mechanical properties of materials. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113150497-A |
| priorityDate |
2020-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |