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filingDate 2020-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e9c95376e9d800db82151de14bdeaff
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publicationDate 2021-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112279976-A
titleOfInvention Photo-curing resin composition and preparation method and application thereof
abstract The invention belongs to the field of resin materials, and discloses a light-cured resin composition, and a preparation method and application thereof. The photo-curing resin composition comprises the following components: micro-nano-sized silicon-containing particles, rubber, an acrylate monomer, epoxy resin and a photoinitiator; the micro-nano silicon-containing particles are organically modified silicon dioxide and/or silicon micropowder; the rubber is rubber with a core-shell structure. By using the photo-curing resin composition prepared by the invention, a molded product obtained by 3D printing has good mechanical properties, such as tensile modulus which can exceed 3000MPa, tensile strength which can exceed 70MPa and heat distortion temperature which can exceed 80 ℃. The industrial parts prepared from the light-cured resin composition have stable structure.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113045709-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114773788-A
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priorityDate 2020-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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