| abstract |
The invention provides a sensitizing compound, a photosensitive resin composition and their respective applications. The sensitizing compound has a structure shown in general formula (I), R 1a , R 2a , R 3a , R 4a , R 1b , R 2b , R 1c , R 2c , R 3c , and R 4c each independently represent hydrogen, straight-chain or branched-chain alkyl, cycloalkyl, cycloalkyl Alkyl, alkylcycloalkyl, -NO 2 , -OR A , -COR A , -COOR A , -SR A , -SO 2 R A or -CONR A R B ; A in general formula (I) represents *O*, *S*, or group; or A in the general formula (I) represents -CR 1 R 2 . Compared with the general sensitizers commonly used at present, the compound with the above general formula (I) has larger molecular weight and stable structure, so it has the characteristics of high sensitization, difficult sublimation, low migration, easy preparation and low cost. |