http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112250865-A

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filingDate 2020-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_14abec160f2bdf8f5a4a84f64b9240dd
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publicationDate 2021-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112250865-A
titleOfInvention Modified maleimide resin prepolymer and preparation method thereof, resin composition, prepreg, laminate and printed circuit board
abstract The present invention provides a modified maleimide resin prepolymer, which is at least prepolymerized from a maleimide compound and an allyl compound, and the allyl compound includes the structure shown in structural formula (1). The siloxy allyl compound and/or the siloxy propenyl compound represented by the structural formula (2). Compared with the prior art, the present invention introduces a siloxy group into the maleimide resin system, mainly modifies the maleimide compound by an allyl compound containing a siloxy group at the end, and the silicon-oxygen bond has better properties. The flexibility and heat resistance of the bismuth resin system play a certain role in stress absorption in the resin composition, so as to maintain good heat resistance and high temperature modulus value, and further improve the water absorption, toughness and low CTE of the double horse resin system. In addition, the steric hindrance effect of the siloxane-containing group at the end is greater than that of the hydroxyl group, which greatly prolongs the room temperature storage period of the modified resin, the resin composition and the prepared prepreg.
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