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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
filingDate 2020-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed11ccb78336f72218e6587f30f7cf90
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publicationDate 2021-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112250838-A
titleOfInvention A kind of curing agent for mica adhesive and preparation method thereof
abstract The invention provides a curing agent for mica adhesive and a preparation method thereof. The curing agent for mica adhesive comprises the following components in parts by weight: 8-20 parts of dibasic acids, 20-30 parts of polyols, 15-25 parts of small molecular esters, 30-40 parts of isocyanates and 0.5 parts of catalysts ‑1 serving. The curing agent for mica adhesive is a curing agent for epoxy resin, which can significantly shorten the curing time of epoxy resin, and can strengthen the cohesiveness and mechanical strength of epoxy resin, thereby greatly improving the interlayer between mica layers. Adhesive force, improve the overall performance of mica, and ensure that mica does not delaminate and crack.
priorityDate 2020-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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