http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112248331-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-34 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-22 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
| filingDate | 2020-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112248331-B |
| titleOfInvention | Chip glue spreading constant-temperature turnover device and method |
| abstract | The invention relates to a chip glue spreading constant-temperature turnover device which comprises an upper die and a lower die which are hemispherical, wherein the upper die and the lower die form a complete sphere when being clamped and connected; the chip glue-spreading constant-temperature turnover device also comprises a feeding assembly, a manipulator and a conveying belt; the feeding assembly comprises two guide rail strips and a pushing mechanism which are transversely arranged side by side, and positioning grooves are respectively arranged on two sides of the outer surface of the lower die; the conveying belt is obliquely arranged at an angle smaller than 30 degrees, the upper surface of the conveying belt moves from low to high, and an electric striker plate is arranged at the lower end of the conveying belt; the lower die is provided with a glue filling cavity and a constant temperature heating unit, and the constant temperature heating unit comprises a spiral heating wire sleeved outside the glue filling cavity; the upper die is provided with a sealing cover part; not only can be in batches spread the encapsulation of gluing to the chip and carry out the delayed cooling processing of heating, still adopt the transmission band to drive the spheroid and carry out the roll of random direction simultaneously and make the deposit of inside glue distribute very evenly at the in-process that solidifies. |
| priorityDate | 2020-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 |
Total number of triples: 25.