http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112233993-B

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2887
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-00
filingDate 2020-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-112233993-B
titleOfInvention Method and apparatus for detecting through-wafer via defects
abstract The invention provides a method and a device for directly detecting the on-off state of a through hole. The device can be composed of carbon nanotube probes to form an array template. Move the probe down to the bottom of the hole layer. When the hole layer is completely open or there is a residual dielectric layer, the conductivity of the material at the bottom is different. In this way, the on-off state of the through hole can be directly detected by the change of the voltage on the probe. When the data directly detected by the station is used to feedback whether the previous process parameters are suitable, the problem that the current hole layer detection can only be detected after the metal is filled, and the feedback lag problem is solved.
priorityDate 2020-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-200722742-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559581
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID297

Total number of triples: 18.