| abstract |
Semiconductor devices and related methods. In one example, an electronic device can include: (a) a first substrate including a first encapsulant extending from a bottom side of the first substrate to a top side of the first substrate and extending from the first substrate a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and including first component sidewalls coated by said first encapsulant, (c) a second electronic component coupled to said first substrate topside, (d) first internal interconnects, which couples the second electronic component to the first substrate interconnect, and (e) a capping structure on the first substrate and capping the second component sidewalls and the first internal interconnect. |