| abstract |
Embodiments of the present invention provide a method for forming a chip package structure. The method includes forming a first conductive bump and a first annular structure on the chip. The first annular structure surrounds the first conductive bump, the first annular structure and the first conductive bump are made of the same first material, the chip includes an interconnection structure, and the first annular structure is electrically insulated from the interconnection structure and first conductive bumps. The method includes bonding the chip to the substrate via the first conductive bumps. |