| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d210742f00ee2ded58b7dab3d79d178d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75314
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-79314
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-79315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73269 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-79 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate |
2020-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ef2e8b9a89443dd2359e503f8dbb99c |
| publicationDate |
2020-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-112133644-A |
| titleOfInvention |
Material-bonding device for bonding partners of power electronic components |
| abstract |
A device is proposed which has a compression mould and has an elastic cushion element for the pressure sintering of a first bonding partner and a second bonding partner of a component, in particular in a power electronic component, wherein the elastic The spacer element is surrounded by a geometrically stable frame, within which the spacer element and the mounting element of the die are guided in a linearly displaced manner so that the geometrically stable frame is lowered onto or onto the first engagement partner on the workpiece carrier on which the first bonding partner is arranged, and after the frame is supported on the first bonding partner or on the workpiece carrier, lowering the die together with the elastic pad element onto the second bonding partner, and A resilient cushion element applies the required pressure to engage the first engagement partner to the second engagement partner, and wherein the cushion element comprises a resilient enclosure and a liquid or gel-like medium enclosed by the enclosure. |
| priorityDate |
2019-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |