| abstract |
Examples are disclosed relating to a heat transfer device including a vapor chamber and a flexible hinge. One disclosed example provides an electronic device including a first portion and a second portion connected by a hinge region, and a vapor chamber extending across the hinge region from the first portion to the second portion, the vapor chamber including: the vapor chamber includes a first layer comprising titanium, a second layer comprising titanium bonded to the first layer to form a vapor chamber, a working fluid within the vapor chamber, and a third layer comprising titanium positioned between the first layer and the second layer, the third layer comprising one or more features configured to direct the working fluid via capillary action. |