http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112105198-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07222086974b8416beea4cbe35fbbd7a |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-0243 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-02 |
filingDate | 2020-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3f54db8688b267eda0123dde5d9333b |
publicationDate | 2020-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-112105198-A |
titleOfInvention | Preparation method of casing, casing and electronic device |
abstract | The application discloses a preparation method of a casing, a casing and an electronic device, and belongs to the technical field of casing preparation. The method includes: preparing a texture layer on the first surface of the substrate, the texture layer has a preset texture pattern; performing three-dimensional high-pressure molding on the substrate to obtain a three-dimensional shell with a three-dimensional structure; preparing a coating layer on the texture layer of the three-dimensional shell to obtain the shell In this application, a textured layer is prepared on the substrate of the electronic device housing, and the substrate is subjected to three-dimensional high pressure molding to obtain a three-dimensional shell with a three-dimensional structure, and then a coating layer is prepared on the textured layer of the three-dimensional shell. The step of preparing the coating layer is after the three-dimensional high pressure forming, thus avoiding the large-area cracking of the coating layer and the texture layer during the three-dimensional forming process of the thick coating layer, so that the shell with the thick coating layer can be prepared. Body, improve the quality and appearance of electronic equipment casing. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113071113-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114845494-A |
priorityDate | 2020-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.