http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112063345-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 |
| filingDate | 2020-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112063345-B |
| titleOfInvention | A kind of nanometer conductive and thermally conductive adhesive and its application |
| abstract | The invention discloses a nanometer conductive and thermally conductive adhesive and an application thereof, comprising the following preparation materials: multi-walled carbon nanotubes coated with metal layers on the surface, nano-solder fillers, epoxy resin system and flux, wherein the surface is coated with The carbon/metal weight ratio in the multi-walled carbon nanotubes of the metal layer is 1~1.2, the metal layer is doped with boron or silicon, and the doping amount of the boron or silicon is 5~1.2 of the total mass of the metal layer. 8%. The conductivity of metal-coated multi-walled carbon nanotubes is improved by doping boron or silicon in the metal-coated material; by adding carbon nanotubes, the specific surface of the conductive and thermally conductive adhesive is improved. The tubes are connected to form a three-dimensional conductive structure, which greatly improves the conductivity, reduces the amount of fillers, and saves production costs; nano-structured solder fillers are used to make them have better dispersion and larger specific surface area, and increase the same amount of addition. lower conductivity. |
| priorityDate | 2020-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.