http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112040349-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_83269a52236c48996072fba2224d22cd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F25B21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04Q1-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04Q1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04L12-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-2039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20172 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04Q1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F25B21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04L12-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04Q1-04 |
| filingDate | 2020-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_416e88f066c182932226428003bc26b7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3ab6eb13f84afa2f10641ccfb502d74 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e81bccf6d8d692cb09d58e0ebf44c12b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb54cd8872f7dd11893668899a862c86 |
| publicationDate | 2020-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112040349-A |
| titleOfInvention | Multifunctional gateway |
| abstract | The invention provides a multifunctional gateway, which comprises a shell and a circuit board arranged in the shell, wherein an electric element and a plurality of data connectors are arranged on the circuit board, and the data connectors protrude out of the top surface of the shell; the shell comprises an upper shell and a lower shell which are matched with each other, a heat conducting plate is fixedly arranged on the bottom surface of the upper shell, the heat conducting plate plugs the bottom of the upper shell to form a closed cavity in the upper shell, and the circuit board is arranged in the closed cavity; the top surface of the upper shell is embedded with a control panel; the circuit board is provided with a plurality of through holes at vacant positions outside the electric elements, the top surface of the heat conducting plate is provided with a plurality of heat conducting columns corresponding to the through holes, and the heat conducting columns extend into the closed cavity through the through holes; the bottom surface of the heat conducting plate is provided with at least one semiconductor refrigerating piece, and the refrigerating surface of the semiconductor refrigerating piece is arranged close to the bottom surface of the heat conducting plate; the novel heat dissipation structure has the advantages of being novel in structure, convenient to disassemble and assemble, capable of providing good heat dissipation, effectively preventing the electric elements from being damaged and prolonging the service life of equipment. |
| priorityDate | 2020-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.