http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112004964-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2019-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_690a3ef7c57ff60d1e507c13fb4b0158 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9bd23a626609ff2ebd910153064e2dad http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17278954c87b8e68b0d2fd0508e9b609 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c482ae73dfa4bcdd7a2dd2c84bc2fbd5 |
| publicationDate | 2020-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-112004964-A |
| titleOfInvention | Surface treatment of copper foil, copper clad laminate and printed circuit board |
| abstract | The present invention provides a surface-treated copper foil having fine wiring workability capable of forming fine wiring with an L&S of, for example, 30/30 μm or less by a subtractive method with excellent process cost, and excellent adhesion to a resin substrate. The foil thickness of the surface-treated copper foil having the roughened surface formed by the roughening treatment on the surface is 10 μm or less, and the vertex curvature arithmetic mean value Ssc of the roughened surface is 0.7 μm -1 or more and 3.8 μm -1 or less. In addition, when the cross section was analyzed by electron backscatter diffraction after heating at 200° C. for 2 hours, among the crystal grains with a crystal grain size of 0.5 μm or more, there were individual crystal grains with a crystal grain size of 0.5 μm or more and less than 1.0 μm. The number ratio R1 is 0.51 or more and 0.97 or less, the number ratio R2 of the number of crystal grains whose crystal grain size is 1.0 μm or more and less than 3.0 μm is 0.03 or more and 0.42 or less, and the number of crystal grains whose crystal grain size is 3.0 μm or more. The number ratio R3 is 0.07 or less. |
| priorityDate | 2018-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.