http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111994867-A

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filingDate 2020-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9b55000c8905ae43a118ecba677c96c
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publicationDate 2020-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-111994867-A
titleOfInvention A method for fabricating large-area controllable nanochannels based on a floating mask and growing thin film method
abstract The invention discloses a method for preparing a large-area controllable nano-channel based on a floating mask and growing thin film method. A single-throw <100> silicon wafer with a thickness of 450 microns and a thickness of 2 inches and a micro-bridge structure with a width of several 2 microns are prepared. First, spin-coat a layer of LOR10B primer on the surface of the cleaned silicon wafer, and drop LOR10B on the silicon wafer so that the glue can completely cover the silicon wafer. A method for preparing large-area controllable nano-channels based on a floating mask and growing thin film method of the present invention adopts the floating mask technology, the angle evaporation growing thin film method and the reactive ion etching technology to prepare the nano-channels on the silicon wafer Road; photoresist suspended micro-bridges are obtained by UV exposure double-layer adhesive development, and then an aluminum film is grown by an angle of electron beam evaporation to obtain the nano-gap of the aluminum film. Finally, the aluminum film is used as a mask and etched by reactive ion etching technology. For silicon wafers, silicon nanochannels can be obtained after removing the aluminum film. At the same time, this method can realize large-scale quantitative production and is inexpensive.
priorityDate 2020-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 43.