http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111968961-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4853 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0296 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76895 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 |
| filingDate | 2020-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111968961-B |
| titleOfInvention | Sidewall interconnection board and its manufacturing process |
| abstract | The invention relates to a side wall interconnection board and a manufacturing process thereof. Each side of a silicon wafer is provided with a side pad of the silicon wafer, and each side pad of the silicon wafer is provided with a side solder ball of the silicon wafer. The chip is provided with a vertical connecting column, the front side of the silicon chip is provided with a front side pad of the silicon chip, and the back pad of the silicon chip is provided with a backside solder ball of the silicon chip; the chip includes a chip body, which is on the back of the chip body There are pads on the back of the chip, and solder balls on the back of the chip are arranged on the pads on the back of the chip; the stacking module is fixed in the groove of the PCB board, the solder balls on the side of the silicon chip are welded and fixed with the pads on the side of the PCB board, and the solder balls on the back of the silicon chip are fixed. It is welded and fixed with the pads on the bottom of the PCB board, and the solder balls on the back of the chip are welded and fixed with the pads on the front of the silicon wafer. The invention can reduce the area of the PCB board, the thickness of the stacking module can be adjusted, and the sidewall area of the stacking module can be increased or decreased as required. |
| priorityDate | 2020-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.