| abstract |
A test apparatus (100) for electrically testing integrated circuits on a wafer (102) is provided. The test device (100) comprises: a vacuum chamber (109); a chuck (101), the chuck (101) for holding the wafer (102); a probe card (103), the probe card (103) for electrically contacting the integrated circuit; and a radiation shield (107), the radiation shield (107) being arranged inside the vacuum chamber (109) and enclosing the chuck (101) and the probe card (103). In the testing apparatus (100), the vacuum chamber (109) is provided with a gate valve (123), the radiation shield (107) is provided with a door (122), and the testing apparatus (100) comprises a wafer loading assembly (125), the wafer loading assembly (125) being for loading the wafer (102) onto the chuck (101) through the gate valve (123) and the door (122). |