| abstract |
Embodiments of the present application provide a package for an integrated circuit and a method for forming the package, the method comprising: bonding a second package element to a first package element, bonding a third package element to the first package element, bonding a dummy die Attaching to the first package element, encapsulating the second package element, the third package element and the dummy die in the encapsulant, and performing a planarization process to align the top surface of the second package element with the top surface of the encapsulant flat. After the planarization process, the upper portion of the encapsulant overlaps the dummy die. Saw cutting through the dummy die to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper part of the sealant is sawed through. |