| abstract |
The invention relates to the technical field of adhesives, and discloses a temporary bonding adhesive material used for thin wafer processing to protect wafers from damage by ultraviolet lasers. The temporary bonding adhesive material is made from the following raw materials in parts by weight: 25- 45 parts of polymer matrix resin, 0-5 parts of tackifying resin, 0.2-2 parts of high temperature antioxidant, 0-0.3 parts of leveling agent, 0.2-5 parts of light absorbing material, 0-5 parts of reflective material, 55-75 parts parts of solvent. The invention can better protect the wafer surface from damage by increasing the ultraviolet laser absorbance of the temporary bonding adhesive layer and reducing the ultraviolet laser transmittance, and the invention can effectively prevent the ultraviolet laser from damaging the device wafer surface through the temporary bonding material . |