| abstract |
The invention relates to a prepreg and a circuit substrate. The material of the prepreg is a composition, including a mixture of modified dielectric fillers and a fluorine-containing resin. The modified dielectric filler is a dielectric filler coated with a mixed coupling agent on the surface. , the dielectric constant of the dielectric filler is less than or equal to 20, and the mixture of modified dielectric fillers includes a first modified dielectric filler with a particle size greater than or equal to 6 μm and a second modified dielectric filler with a particle size of less than 6 μm. Therefore, the density of the prepreg can be effectively improved through the mixing and modification of the dielectric filler by the mixed coupling agent and the grading and compounding of the particle size. Correspondingly, the density of the dielectric layer made of it is high. Therefore, in the present invention, the Dk value of the dielectric layer of the circuit substrate can reach 2.9 to 3.0 by using a dielectric filler with Dk less than or equal to 20, and the TcDk of the dielectric layer has little influence. The wear of the drill pin is small and the processing performance is excellent. |