| abstract |
The present invention relates to a negative photosensitive resin composition comprising (a) an epoxy resin, (B) a compound having a phenolic hydroxyl group, and (C) a photo-cationic polymerization initiator, wherein 30% by mass or more of the (a) epoxy resin is an epoxy resin (a-1) represented by the following formula (1) (in the formula (1), R independently represents a glycidyl group or a hydrogen atomAt least two of the R groups present in plural are glycidyl groups, a represents an average value of the number of repeating units and is a real number in the range of 0 to 30, and (B) the compound having a phenolic hydroxyl group and (C) the photo cation polymerization initiator have a specific structure. |