| abstract |
The invention relates to the field of polymer materials, and discloses an ultra-high temperature resistant polyimide film and a preparation method and application thereof. The polyimide in the ultra-high temperature-resistant polyimide film includes a diamine structural unit and a dianhydride structural unit, wherein the diamine structural unit includes a structural unit shown in formula I, and the dianhydride structure The unit comprises the structural unit shown in formula II, and based on the total molar weight of the diamine structural unit, the content of the structural unit shown in the formula I is 30-100%, based on the total molar weight of the dianhydride structural unit, the formula II The content of the structural unit shown is 30-100%, The ultra-high temperature resistant polyimide film has excellent high temperature stability and mechanical properties, and can be used in high temperature resistant vacuum bags, OLED substrates, electronic packaging, solar cells and other fields that require high temperature mechanical and dimensional stability of the film. . |