http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111796483-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2020-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111796483-B |
| titleOfInvention | Resin composition, mixture, dry film resist and corresponding element |
| abstract | The invention relates to a resin composition, a mixture, a dry film resist and a corresponding element, belonging to the technical field of preparation of circuit printing elements. The resin composition comprises the following raw materials in parts by weight: 50-70 parts of a binder polymer; 10-50 parts of a photo-polymerization monomer; 0.5-5.0 parts of photoinitiator; 0.1-5.0 parts of defoaming agent; wherein the photopolymerization monomer contains a compound shown in a general formula (I), and the defoaming agent contains a compound shown in a general formula (II). The resin composition has excellent flexibility, chemical resistance and plating resistance, low development foam and good side appearance of a dry film after development; furthermore, when the resin composition is used as a dry film resist for preparing elements, the product yield and the production efficiency can be effectively improved. |
| priorityDate | 2020-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.