| abstract |
The invention discloses an epoxy resin micro-nano blended composite material for encapsulating power electronic high-power devices and a preparation method, and belongs to the cross field of high voltage and insulation technology and composite materials. In the process of preparing the composite material, the nano-aluminum nitride surface modified by silane coupling agent is first prepared as a thermally conductive filler, which is uniformly dispersed in the epoxy resin by ultrasonic waves, and the micro-nano composite material is prepared by vacuum degassing, infusion molding and other processes. mixed composite materials. The micro-nano blended composite material has excellent thermal conductivity and electrical insulation properties, and can be used as a packaging material for power electronic high-power devices. The preparation method of the micro-nano blended composite material is simple, easy to operate, and low in cost, and is suitable for industrial production. |