http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111732898-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
| filingDate | 2020-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111732898-B |
| titleOfInvention | CMP slurry composition and method of polishing patterned tungsten wafer using the same |
| abstract | The present invention relates to a chemical mechanical polishing slurry composition for patterning a tungsten wafer and a method of polishing a patterned tungsten wafer using the same. The chemical mechanical polishing slurry composition comprises: at least one selected from the group consisting of polar solvents and non-polar solvents; an abrasive; at least one selected from the group consisting of a compound represented by formula 1 and a compound represented by formula 2; and tetrabutylammonium hydroxide. |
| priorityDate | 2019-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.