http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111675987-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-064 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J193-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F18-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-1804 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J169-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J193-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-14 |
| filingDate | 2020-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111675987-B |
| titleOfInvention | pressure sensitive adhesive |
| abstract | The aim is to provide pressure-sensitive adhesives capable of achieving high bond strengths, especially to non-polar or rough substrates. This object is achieved using a pressure-sensitive adhesive comprising: a) at least one poly(meth)acrylate; b) at least one resin A selected from rosin resins and terpene-phenolic resins; c) at least one resin having greater than Hydrocarbon resin B1 having a softening point of 50°C; and d) at least one hydrocarbon resin B2 having a softening point of less than or equal to 25°C. A further subject of the present invention is an adhesive tape comprising the pressure-sensitive adhesive of the present invention, and the use of the pressure-sensitive adhesive of the present invention or the adhesive tape of the present invention for the production of substrates with low surface energy and/or substrates with an average roughness of at least 5 μm The use of adhesive bonding. |
| priorityDate | 2019-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 169.