http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111653532-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3672 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3675 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 |
| filingDate | 2020-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-111653532-B |
| titleOfInvention | A high heat flux density chip heat sink and its manufacturing method |
| abstract | The present application relates to a high heat flux density chip heat dissipation device and a preparation method thereof. The high heat flux density chip heat dissipation device comprises a heat dissipation box and a chip shell, the heat dissipation box is a hollow structure, the chip shell is placed inside the heat dissipation box, and the chip is packaged in a In the chip casing, a heat dissipation filler is filled between the heat dissipation box and the chip casing, a curing agent capsule and a liquid metal capsule are embedded on the top of the chip casing, and the curing agent capsule at least includes a silicone resin capsule layer and a curing agent capsule layer , the curing agent capsule layer covers the silicone resin capsule layer, and the liquid metal capsule contains at least the liquid metal capsule layer. The embodiment of the present application provides a high heat flux density chip heat sink and a manufacturing method thereof. Since a liquid metal capsule and a curing agent capsule are arranged on the top of the chip shell, the liquid metal can be fixed on the chip by applying pressure during glue welding. The top of the shell can effectively prevent the welding breakage caused by the expansion of liquid metal when overheating, and the replacement and maintenance costs are lower. |
| priorityDate | 2020-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 92.