http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111613383-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E40-60 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B12-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B12-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B12-06 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B12-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B12-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B12-16 |
filingDate | 2020-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-111613383-B |
titleOfInvention | High-temperature superconducting tape for improving thermal stability |
abstract | The invention discloses a high-temperature superconducting tape for improving thermal stability, which comprises a superconducting tape body and a metal reinforcing layer fixedly arranged on at least one side of the superconducting tape body, wherein: the superconducting tape body sequentially comprises from top to bottom: the copper-based composite material comprises a copper stabilizing layer, a substrate layer, a buffer layer, a transition layer, a superconducting layer, a silver stabilizing layer and a copper stabilizing layer; on at least one of the metal reinforcing layers, the surface of the metal reinforcing layer far away from the superconducting tape body is provided with an uneven surface; the thickness of the metal reinforcing layer is 20-200 μm. The invention can improve the heat dissipation efficiency and the thermal stability of the high-temperature superconducting tape. |
priorityDate | 2020-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.